Wafer Bumping
CHIPBOND TECHNOLOGY

Gold (5", 6", 8" & 12")
• Gold + PI
• Gold + RDL

Solder (5", 6", 8" & 12")
• Solder + BCB/PI
• Lead Free (Sn/Ag)
• High Lead (95/5)
• Eutectic (63/37)

Copper Pillar (8" & 12")

Assembly

COF (Chip on Film/Flex)
TCP (Tape Carrier Pkg.)

COG (Chip on Glass)
• CP (Chip Probing)
• Back Grinding
• Dicing
• Pick & Place(Waffle Tray)

Wafer Backside Metallization(BSM)
• Wafer Back Grinding



Printed Circuit Boards (PCB's)
WUS

• Double sided & Multilayer
• HDI (High Density Interconnection), laser microvias
• Buried & blind vias
• Solid micro vias
• Thin & fine line circuitry



Electronic Components
Abstract Electronics

• Active / Passive Components
• Electromechanical
• EOL (End Of Life)
• InterConnects
• Mil-Spec
• Networking Solutions
• Obsolescence
• Optoelectronics
• Power
• Rohs / Non-Rohs
• Sensors
• Test & Measurement
• Thermal Management
• Wire & Cable



UV Curable Adhesives & Coatings
Microcoat Technologies, LLC

• Epoxy Filled & Unfilled Glob Top Systems
• MCM Dam & Fill Materials both Rigid & Flexible
• Medical Adhesives

Smart Card IC Coatings
• Optically Clear Rigid & Flexible Systems for LED’s
• Detectors
Fiber Optics
• Silicone Replacement High Elongation & elastomeric
  coatings & potting materials for MCM's, PCB's & Kapton
Mylar
• 12 Types of Conductive Epoxies for Die Attach
• PCB Repair

Electronics materials
• UV Cure Epoxy Conformal Coatings for PCB Applications
• Flexible CircuitryCcoatings



Volume Thin Film Deposition
KERDRY

• Metallization
• Optical Coatings
• Fiber Optics
• Substrates