• Microelectronic Interconnect Materials
• Glass & Ceramic-to-Metal Components
• High Performance Packages
• Printed Circuit Boards
• Advanced Ceramics
UV Curable Adhesives & Coatings
• Volume Thin Film Deposition
• Bond Copper &
Reinforced Aluminum



Printed Circuit Boards (PCB's)
WUS

• Double sided & Multilayer
• HDI (High Density Interconnection), laser microvias
• Buried & blind vias
• Solid micro vias
• Thin & fine line circuitry




UV Curable Adhesives & Coatings
Microcoat Technologies, LLC

• Epoxy Filled & Unfilled Glob Top Systems
• MCM Dam & Fill Materials both Rigid & Flexible
• Medical Adhesives

Smart Card IC Coatings
• Optically Clear Rigid & Flexible Systems for LED’s
• Detectors
Fiber Optics
• Silicone Replacement High Elongation & elastomeric
  coatings & potting materials for MCM's, PCB's & Kapton
Mylar
• 12 Types of Conductive Epoxies for Die Attach
• PCB Repair

Electronics materials
• UV Cure Epoxy Conformal Coatings for PCB Applications
• Flexible CircuitryCcoatings




Volume Thin Film Deposition

KERDRY

• Metallization
• Optical Coatings
• Fiber Optics
• Substrates




Glass & Ceramic-to-Metal Hermetic Components

PNL INNOTECH
Low weight heat sinks (Carbon Composite-Titanium)
. Glass to Titanium seals
. Bakeable feedthroughs and connectors, including Nano D
. Housings for medical implant
. U.H.V viewports (Glass,Quartz,Sapphire,CaF2,BaF2)
. Metal brazing to ceramics   (Alumina,Zirconia,B4C,AlN,SiC,Si3N4…)




Advanced Ceramics
MICROCERTEC

• Heat sinks for laser systems
• Insulators and structural parts for laser
  & optoelectronic systems
• Reflectors for lasers & pulsed-light systems
• Substrates, insulators, dielectrics for the
  Microelectronics
• 3D interconnection devices
• End-effectors & chucks for wafer handling
• Components for the Semicon
• Components for the Aerospace
• Components for medical and scientific
  instrumentation
• Wear resistance components for pumps
  and valves
• Components made of Macor®



Microelectronic Interconnect Materials
KOARTAN

Products

Thick Film Paste


Conductors
• Silver
• Palladium-Silver
• Platinum-Silver
• Platinum-Palladium-Silver
• Gold


Resistors

Thermistors
• NTC
• PTC

Dielectrics/Glazes
• Multi-layer
• Capacitor

• Sealing Glasses
• Glazes

Powders (High Purity Metals)
Silver
Palladium
• Platinum
• Gold
• Ruthenium

Our precious metal powders are available in a
wide variety of particle sizes and morphologies.
Please contact us directly for your specific
requirements.

Ceramic Powders & Fine Chemicals
Ceramic
• Glass
• Metalloid Organics

We carry a wide variety of oxides, ceramics,
vitreous and crystallizing glasses that are
available for R & D and small scale production
requirements. Please contact us directly for
the most suitable candidates for your
application.




Bond Copper / Reinforced Aluminum
ReMETAI LLC

• Micro Direct Bond Copper (mDBCTM) metallized ceramic
  substrates including aluminum nitride, aluminum oxide and
  beryllium oxide substrates metallized with 25-75 micrometers
  of copper

• Carbon fiber reinforced aluminum (CarfAlTM) metal matrix
  composite - an easily machined and plated material for package
  cases and base plates

• Silicon-reinforced aluminum matrix composite (SiAlTM) for
  package cases and base plates

• Diamond-reinforced aluminum (DiAlTM) and copper matrix
  (DiCoppTM) composites for base plates applications.